Advanced公司有着30多年的连接器专业设计经验 , 并自家拥有多样化的生产设备及配件 , 可以创新设计高可靠的电子应用连接方案。跟竞争对手 , 与别不同。我司富经验的工程师与客户紧密联系 , 并能了解客户的应用要求 , 为客户提供专有的设计方案和高可靠性的快速样品。
生产各类插座及印刷板插针/插座，板对板连接器，IC插座和转换器，封装转换器，BGA插座:提供0.75至1.5mm间距,各种脚位均可订制
PGA插座:4至840位
PEEL-A-WAY(轻揭式):专利无座式设计, 方便安装节省空间
插针/插座:数百款标准或非标准插座
订制:插针/插座可按客户要求
* Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) withlarger sizes available upon request
* Precision machined spring probes offer high bandwidth with very low insertion loss* Compact size (small keepout zone) enables use on design boards
* Flip-Top BGA Socket's easy actuation with simple cover and turn-screw heat sinkenables quick insertion and extraction
* SMT design eliminates the cost of hardware and mounting holes and their
associated interference with traces on the PCB
* Modular design of lower assembly enables simple reflow process, similar to BGAdevice
* Metallic probes offer proven reliability over elastomeric sockets and long-life (springprobe contact system life is 200,000 cycles minimum)
* Suitable for use with automated pick & place equipment
* Additional mounting options and custom designs available
0.50间距Mod-5 Flip-Top BGA插座数据表
参考连结:
0.50间距Mod-5 Flip-Top BGA插座数据表
Contact Acceptance Range Data:
1. Mod5 Series Flip-Top™ Test Socket (0.50mm pitch models) Installation & General Usage Instructions
AIC_FT-INS-003_revMay10.pdf
2. BGA Device Dimension & Design Your Own Footprint Form - required if device package mechanical specifications are not available
AIC_BGA_DesignYourOwn_16A_rev1_Fillable.pdf
